- 专利标题： Polyamic acid and polyimide, processes for the production of same, compositions containing same, and uses thereof
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申请号： US13203343申请日： 2010-02-26
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公开(公告)号： US09752030B2公开(公告)日： 2017-09-05
- 发明人: Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Ichiro Fujio , Wataru Yamashita
- 申请人： Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Ichiro Fujio , Wataru Yamashita
- 申请人地址： JP Tokyo
- 专利权人： MITSUI CHEMICALS, INC.
- 当前专利权人： MITSUI CHEMICALS, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Buchanan, Ingersoll & Rooney PC
- 优先权： JP2009-051102 20090304
- 国际申请： PCT/JP2010/001332 WO 20100226
- 国际公布： WO2010/100874 WO 20100910
- 主分类号： C08L79/08
- IPC分类号： C08L79/08 ; B32B15/08 ; B32B15/20 ; B32B27/34 ; B32B27/36 ; C09D179/08 ; C08G73/10 ; H05K1/03
摘要：
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
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