Invention Grant
- Patent Title: Insulated flowpath assembly
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Application No.: US14790928Application Date: 2015-07-02
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Publication No.: US09759356B2Publication Date: 2017-09-12
- Inventor: Joe Ott , John J. Rup, Jr. , Shawn Stempinski , Stanley J. Funk , Dennis M. Moura , Lyutsia Dautova , Roger O. Coffey
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: O'Shea Getz P.C.
- Main IPC: F16L9/14
- IPC: F16L9/14 ; F16L9/18 ; F23R3/28 ; B33Y80/00 ; B22F3/105 ; F16L59/14 ; F02C7/22 ; B33Y10/00

Abstract:
A flowpath assembly has a first conduit defining a flowpath radially inward, and a second conduit spaced radially outward from the first conduit. A void defined between the first and second conduits contains an insulating material that may have a greater porosity than the first and second conduits. The assembly may be additive manufactured generally as one unitary piece with the raw material of the conduits being melted and solidified on a slice-by-slice basis and the insulating material being selectively bypassed by an energy gun of an additive manufacturing system.
Public/Granted literature
- US20160003380A1 INSULATED FLOWPATH ASSEMBLY Public/Granted day:2016-01-07
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