Invention Grant
- Patent Title: Probe module
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Application No.: US14558558Application Date: 2014-12-02
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Publication No.: US09759746B2Publication Date: 2017-09-12
- Inventor: Wei-Cheng Ku , Hao Wei , Shin-Lan Kao
- Applicant: MPI CORPORATION
- Applicant Address: TW Zhubei
- Assignee: MPI CORPORATION
- Current Assignee: MPI CORPORATION
- Current Assignee Address: TW Zhubei
- Agency: Apex Juris, pllc.
- Agent Tracy M. Helms
- Priority: TW102146096A 20131213
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R3/00 ; G01R1/067 ; G01R1/18

Abstract:
A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
Public/Granted literature
- US20150168447A1 PROBE MODULE Public/Granted day:2015-06-18
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