Invention Grant
- Patent Title: Enabling stiff plastic chassis with thin metal skins
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Application No.: US14126258Application Date: 2013-06-29
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Publication No.: US09760117B2Publication Date: 2017-09-12
- Inventor: Mark Sprenger , Paul J. Gwin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- International Application: PCT/US2013/048832 WO 20130629
- International Announcement: WO2014/209410 WO 20141231
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; B21D22/02 ; C23C26/00

Abstract:
Particular embodiments described herein provide for an electronic device, such as a notebook computer, laptop, or tablet that includes a circuit board coupled to a plurality of electronic components (which may include any type of components, elements, circuitry, etc.). One particular example implementation of an information-processing device includes a logic component mounted on a circuit board. The information-processing device also includes a plastic layer surrounding the logic component. Further, the information-processing device includes a first metal layer surrounding the logic component. The plastic layer is integrated with the first metal layer.
Public/Granted literature
- US20150192958A1 ENABLING STIFF PLASTIC CHASSIS WITH THIN METAL SKINS Public/Granted day:2015-07-09
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