Invention Grant
- Patent Title: Structure and formation method of finFET device
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Application No.: US14592591Application Date: 2015-01-08
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Publication No.: US09761723B2Publication Date: 2017-09-12
- Inventor: Kuo-Cheng Ching
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/02 ; H01L29/423 ; H01L29/165

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a fin channel structure over the semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin channel structure. The semiconductor device structure further includes a source/drain structure adjacent to the fin channel structure and a doped region between the semiconductor substrate and the fin channel structure. In addition, the semiconductor device structure includes a blocking layer between the fin channel structure and the doped region.
Public/Granted literature
- US20160204260A1 STRUCTURE AND FORMATION METHOD OF FINFET DEVICE Public/Granted day:2016-07-14
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