Invention Grant
- Patent Title: Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point
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Application No.: US14468801Application Date: 2014-08-26
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Publication No.: US09764488B2Publication Date: 2017-09-19
- Inventor: Ryu Komatsu , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Yasuhiro Jinbo , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Daiki Nakamura
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-179697 20130830; JP2014-043408 20140306
- Main IPC: C03B33/027
- IPC: C03B33/027 ; C03B33/07 ; B26D3/08 ; G02F1/13 ; B26D3/28 ; B26F1/38 ; C03B33/037

Abstract:
A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.
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