Invention Grant
- Patent Title: Carrier package and carrier with plural heat conductors
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Application No.: US14461808Application Date: 2014-08-18
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Publication No.: US09768092B2Publication Date: 2017-09-19
- Inventor: Chien-Hung Ho , Chiu-Min Lee , Chen-Shen Kuo
- Applicant: Viking Tech Corporation
- Applicant Address: TW Hukou Township
- Assignee: Viking Tech Corporation
- Current Assignee: Viking Tech Corporation
- Current Assignee Address: TW Hukou Township
- Agency: Davis & Bujold PLLC
- Agent Michael J. Bujold
- Priority: TW103113819A 20140416
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H05K1/02 ; H01L23/367 ; H01L23/373 ; H05K1/03

Abstract:
A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements.
Public/Granted literature
- US20150305201A1 Carrier and Package Having the Carrier Public/Granted day:2015-10-22
Information query
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