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    Carrier and Package Having the Carrier
    1.
    发明申请
    Carrier and Package Having the Carrier 有权
    承运人和包裹承运人

    公开(公告)号：US20150305201A1

    公开(公告)日：2015-10-22

    申请号：US14461808

    申请日：2014-08-18

    Applicant: Viking Tech Corporation

    Inventor： Chien-Hung Ho ,  Chiu-Min Lee ,  Chen-Shen Kuo

    IPC: H05K7/20 ,  H01L23/34 ,  H01L23/14

    CPC classification number: H01L23/34 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0306 ,  H01L2924/00

    Abstract: A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements.

    Abstract translation: 公开了一种载体，包括：具有与第一表面相对的第一表面和第二表面的主体; 形成在主体的第一表面上的导电部分; 以及与导电部不接触并穿透主体以将第一表面与第二表面连接的多个热导体。 因此，电子元件产生的热可以有效地消散在外部，以改善电子元件的功能和寿命。

    Ceramic Substrate and Semiconductor Package Having the Same
    4.
    发明申请
    Ceramic Substrate and Semiconductor Package Having the Same 有权
    陶瓷基板和半导体封装相同

    公开(公告)号：US20150303362A1

    公开(公告)日：2015-10-22

    申请号：US14517781

    申请日：2014-10-17

    Applicant: Viking Tech Corporation

    Inventor： Chien-Hung Ho ,  Chiu-Min Lee ,  Chen-Shen Kuo

    IPC: H01L33/64 ,  H05K1/03 ,  H05K1/11 ,  H01L33/62

    CPC classification number: H01L33/642 ,  H01L24/73 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/73257 ,  H01L2224/73265 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/10106 ,  H01L2924/00014

    Abstract: A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.

    Abstract translation: 提供一种陶瓷基板，包括：板，其具有与第一表面相对的第一表面和第二表面; 设置在第一表面上的第一电接触焊盘; 设置在第二表面上的第二电接触焊盘; 导电柱设置在所述板中并且连接所述第一表面和所述第二表面以电连接所述电接触焊盘和所述第二电接触焊盘; 设置在所述第一表面上的第一导热焊盘; 设置在所述第二表面上的第二导热焊盘; 以及设置在所述板中并且连接所述第一表面和所述第二表面以与所述第一导热焊盘和所述第二导热焊盘接触并耦合的导热柱，其中所述导热柱具有大于或等于宽度的宽度 的导电柱并且大于或等于300微米。

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