Invention Grant
- Patent Title: Package base, package, electronic device, electronic apparatus, and moving object
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Application No.: US14798859Application Date: 2015-07-14
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Publication No.: US09769934B2Publication Date: 2017-09-19
- Inventor: Tetsuro Miyao , Hideki Ishigami , Yukihiko Shiohara , Tetsuya Otsuki , Hidefumi Nakamura
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-145667 20140716
- Main IPC: B32B3/10
- IPC: B32B3/10 ; H05K3/34 ; H05K1/03
Abstract:
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
Public/Granted literature
- US20160021752A1 PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT Public/Granted day:2016-01-21
Information query
