Invention Grant
- Patent Title: Multi-layer full dense mesh
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Application No.: US15181795Application Date: 2016-06-14
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Publication No.: US09773727B2Publication Date: 2017-09-26
- Inventor: Duncan C. Collier , Robert P. Masleid , Aparna Ramachandran , King Yen
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood Shores
- Agency: Osha Liang LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/498 ; H01L21/48 ; H01L49/02
Abstract:
A multi-layer full dense mesh (MFDM) device. The MFDM may include a metal-top layer including a bump pad array that may include a power1 (PWR1) bump pad within a PWR1 bump region, a VSS bump pad within a VSS bump region, and a power2 (PWR2) bump pad within a PWR2 bump region. The metal-top layer may also include a PWR1 majority metal-top region. The MFDM may also include a metal-top-1 layer beneath the metal-top layer and including a VSS majority metal-top-1 region, a PWR1 metal-top-1 region, and a PWR2 metal-top-1 region. The MFDM may also include a metal-top-2 layer beneath the metal-top-1 layer and including a PWR2 majority metal-top-2 region, a VSS metal-top-2 region, and a PWR1 metal-top-2 region. The MFDM may also include top-1 VIAs disposed between the metal-top layer and the metal-top-1 layer, and top-2 VIAs disposed between the metal-top-1 layer and the metal-top-2 layer.
Public/Granted literature
- US20170092579A1 MULTI-LAYER FULL DENSE MESH Public/Granted day:2017-03-30
Information query
IPC分类:
