Invention Grant
- Patent Title: Semiconductor laser element and method of manufacturing semiconductor laser element
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Application No.: US15363712Application Date: 2016-11-29
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Publication No.: US09774169B2Publication Date: 2017-09-26
- Inventor: Yoshitaka Nakatsu
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2015-232583 20151130; JP2016-181721 20160916
- Main IPC: H01S5/34
- IPC: H01S5/34 ; H01S5/30 ; H01S5/343

Abstract:
A semiconductor laser element includes an n-side semiconductor layer, an active layer, and a p-side semiconductor layer, layered upward in this order, each being made of a nitride semiconductor. The active layer includes one or more well layers, and an n-side barrier layer located lower than the one or more well layers. The n-side semiconductor layer includes a composition-graded layer located in contact with the n-side barrier layer. The composition-graded layer has a band-gap energy that decreases toward an upper side of the composition-graded layer, with a band-gap energy of the upper side being smaller than a band-gap energy of the n-side barrier layer. The composition-graded layer has an n-type dopant concentration greater than 5×1017/cm3 and less than or equal to 2×1018/cm3. The n-side barrier layer has an n-type dopant concentration greater than that of the composition-graded layer and a thickness smaller than that of the composition graded layer.
Public/Granted literature
- US20170155230A1 SEMICONDUCTOR LASER ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR LASER ELEMENT Public/Granted day:2017-06-01
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