- 专利标题: Method for manufacturing three-dimensional shaped object
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申请号: US15123114申请日: 2015-03-04
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公开(公告)号: US09776243B2公开(公告)日: 2017-10-03
- 发明人: Satoshi Abe , Masataka Takenami , Isamu Matsumoto
- 申请人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 申请人地址: JP Osaka
- 专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址: JP Osaka
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP2014-043107 20140305
- 国际申请: PCT/JP2015/001156 WO 20150304
- 国际公布: WO2015/133138 WO 20150911
- 主分类号: B23K26/16
- IPC分类号: B23K26/16 ; B22F3/105 ; B33Y30/00 ; B29C67/00 ; B33Y10/00 ; B33Y70/00 ; B23K26/082 ; B23K26/342 ; B22F3/24 ; B23K103/00
摘要:
A selective laser sintering method reduces a warping deformation of a three-dimensional shaped object, the warping deformation being due to the scanning of a light beam. The manufacturing method is a method for manufacturing a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming, wherein a scanning of the light irradiation is divided into light beam-scannings “A” and “B”, the light beam-scanning “A” being for the light irradiation of a peripheral portion corresponding to a periphery of the three-dimensional shaped object, and the light beam-scanning “B” being for the light irradiation of an internal portion corresponding to a region of the three-dimensional shaped object, the region being located inside the periphery. In particular, the peripheral portion is subjected to a discontinuous light beam-irradiation in the light beam-scanning “A” such that an irradiation path of the light beam is divided into a plurality of sub-irradiation paths.
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