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公开(公告)号：US20150290741A1
公开(公告)日：2015-10-15
申请号：US14439494
申请日：2014-07-09
Inventor： Satoshi Abe , Masataka Takenami , Isamu Matsumoto
CPC classification number: B23K26/0093 , B22F3/1055 , B22F3/162 , B22F2003/1056 , B22F2003/247 , B22F2998/10 , B23K26/16 , B28B1/001 , B29C64/153 , B29C64/20 , B29C67/04 , B29L2031/772 , B33Y40/00 , C04B35/622 , C04B35/64 , C04B2235/6026 , C04B2235/612 , C04B2235/665 , Y02P10/295
Abstract: There is provided a selective laser sintering method capable of reducing the trouble in chipping or breakage of the machining tool and the like. The manufacturing method according to an embodiment of the present invention is a method for manufacturing a three-dimensional shaped object by repetition of a powder-layer forming and a solidified-layer forming, the repetition including the steps of (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof, and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam.
Abstract translation: 提供了一种能够减少加工工具等的切屑或破损的麻烦的选择性激光烧结方法。 根据本发明的实施例的制造方法是通过重复粉末层形成和固化层形成来制造三维成形物体的方法，其重复包括以下步骤：（i）形成固化层 通过用光束照射粉末层的预定部分，从而允许粉末在预定部分中烧结或熔融并随后的固化，和（ii）通过在所得到的粉末层上新形成粉末层形成另一固化层 固化层，然后用光束照射粉末层的预定部分。
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公开(公告)号：US11173641B2
公开(公告)日：2021-11-16
申请号：US16065565
申请日：2015-12-25
Inventor： Satoshi Abe , Kenichi Tanaka , Yoshiyuki Uchinono , Isamu Matsumoto , Masataka Takenami
Abstract: There is provided a mold including a movable side mold, a fixed side mold and a sprue bush, the sprue bush including a flow path for a cooling fluid of the fixed side mold, wherein inlet and outlet ports of the flow path for the cooling fluid are in a direct connection with a cooling tube, respectively, the cooling tube being located along a space portion provided in the fixed side mold, and wherein the space portion is in a form of an opening provided in at least one of opposed surfaces of the fixed side mold.
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公开(公告)号：US09776243B2
公开(公告)日：2017-10-03
申请号：US15123114
申请日：2015-03-04
Inventor： Satoshi Abe , Masataka Takenami , Isamu Matsumoto
IPC: B23K26/16 , B22F3/105 , B33Y30/00 , B29C67/00 , B33Y10/00 , B33Y70/00 , B23K26/082 , B23K26/342 , B22F3/24 , B23K103/00
CPC classification number: B22F3/1055 , B22F2003/1056 , B22F2003/1057 , B22F2003/247 , B22F2998/10 , B23K26/082 , B23K26/342 , B23K2103/42 , B29C64/153 , B29C64/40 , B33Y10/00 , B33Y30/00 , B33Y70/00 , Y02P10/295
Abstract: A selective laser sintering method reduces a warping deformation of a three-dimensional shaped object, the warping deformation being due to the scanning of a light beam. The manufacturing method is a method for manufacturing a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming, wherein a scanning of the light irradiation is divided into light beam-scannings “A” and “B”, the light beam-scanning “A” being for the light irradiation of a peripheral portion corresponding to a periphery of the three-dimensional shaped object, and the light beam-scanning “B” being for the light irradiation of an internal portion corresponding to a region of the three-dimensional shaped object, the region being located inside the periphery. In particular, the peripheral portion is subjected to a discontinuous light beam-irradiation in the light beam-scanning “A” such that an irradiation path of the light beam is divided into a plurality of sub-irradiation paths.
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Patent Agency Ranking
公开(公告)号：US09604282B2
公开(公告)日：2017-03-28
申请号：US14439523
申请日：2014-07-09
Inventor： Satoshi Abe , Masataka Takenami , Isamu Matsumoto
CPC classification number: B22F3/1055 , B22F3/24 , B22F2003/1059 , B22F2003/247 , B29C64/153 , B29C64/20 , B29C64/35 , B33Y10/00 , B33Y40/00 , Y02P10/295
Abstract: There is provided a selective laser sintering method capable of reducing the trouble in chipping or breakage of the machining tool and the like. The manufacturing method according to an embodiment of the present invention is a method for manufacturing a three-dimensional shaped object by repetition of a powder-layer forming and a solidified-layer forming, the repetition including the steps of (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof, and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam.
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公开(公告)号：US09597836B2
公开(公告)日：2017-03-21
申请号：US14413350
申请日：2013-03-06
Inventor： Satoshi Abe , Isamu Matsumoto , Masataka Takenami , Masaki Kondo , Isao Fuwa , Yoshiyuki Uchinono
IPC: B29C71/04 , B29C67/00 , B29C69/00 , B22F3/105 , B22F5/00 , B22F3/16 , B33Y10/00 , B29C35/08 , B29K105/00
CPC classification number: B29C67/0077 , B22F3/105 , B22F3/1055 , B22F3/16 , B22F5/007 , B22F2003/1056 , B29C35/0805 , B29C64/153 , B29C69/001 , B29C2035/0827 , B29C2035/0833 , B29C2035/0838 , B29K2105/00 , B33Y10/00 , Y02P10/292 , Y02P10/295
Abstract: There is provided a manufacturing method of the three-dimensional shaped object, the method being capable of suitably reducing the local raised portion which can occur during the light beam irradiation under the condition of the divided sub-irradiation paths. The manufacturing method of the present invention is performed by repetition of a powder-layer forming and a solidified-layer forming, wherein an irradiation path of the light beam is divided into a plurality of sub-irradiation paths including a short sub-irradiation path with its length being shorter than a predetermined length and a long sub-irradiation path with its length being the predetermined length or longer, and wherein an irradiation mode of the light beam is changed depending on the lengths of the sub-irradiation paths.
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公开(公告)号：US09707622B2
公开(公告)日：2017-07-18
申请号：US15123101
申请日：2015-03-04
Inventor： Masataka Takenami , Satoshi Abe , Isamu Matsumoto
CPC classification number: B22F3/1055 , B22F2003/1057 , B22F2003/247 , B29C64/153 , B33Y10/00 , B33Y50/02 , Y02P10/295
Abstract: There is provided a selective laser sintering method capable of reducing the bulge of the peripheral portion corresponding to the periphery of the three-dimensional shaped object. The manufacturing method according to an embodiment of the present invention includes alternate repetition of a powder-layer forming and a solidified-layer forming, the repetition comprising: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby sintering the powder in the predetermined portion or a melting and subsequently solidifying the powder; and (ii) forming another solidified layer by newly forming a powder layer on the formed solidified layer, followed by irradiation of a predetermined portion of the newly formed powder layer with the light beam, wherein a scanning of the light irradiation is divided into light beam-scannings “A” and “B”.
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公开(公告)号：US09586285B2
公开(公告)日：2017-03-07
申请号：US14439494
申请日：2014-07-09
Inventor： Satoshi Abe , Masataka Takenami , Isamu Matsumoto
IPC: B23K26/16 , B23K26/00 , B22F3/24 , B29C67/04 , C04B35/64 , B28B1/00 , B29C67/00 , B33Y40/00 , B22F3/105 , B22F3/16 , C04B35/622 , B29L31/00
CPC classification number: B23K26/0093 , B22F3/1055 , B22F3/162 , B22F2003/1056 , B22F2003/247 , B22F2998/10 , B23K26/16 , B28B1/001 , B29C64/153 , B29C64/20 , B29C67/04 , B29L2031/772 , B33Y40/00 , C04B35/622 , C04B35/64 , C04B2235/6026 , C04B2235/612 , C04B2235/665 , Y02P10/295
Abstract: There is provided a selective laser sintering method capable of reducing the trouble in chipping or breakage of the machining tool and the like. The manufacturing method according to an embodiment of the present invention is a method for manufacturing a three-dimensional shaped object by repetition of a powder-layer forming and a solidified-layer forming, the repetition including the steps of (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof, and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam.
Abstract translation: 提供了一种能够减少加工工具等的切屑或破损的麻烦的选择性激光烧结方法。 根据本发明的实施例的制造方法是通过重复粉末层形成和固化层形成来制造三维成形物体的方法，其重复包括以下步骤：（i）形成固化层 通过用光束照射粉末层的预定部分，从而允许粉末在预定部分中烧结或熔化并随后固化，以及（ii）通过在所得到的层上新形成粉末层形成另一固化层 固化层，然后用光束照射粉末层的预定部分。
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公开(公告)号：US20150183165A1
公开(公告)日：2015-07-02
申请号：US14413350
申请日：2013-03-06
Inventor： Satoshi Abe , Isamu Matsumoto , Masataka Takenami , Masaki Kondo , Isao Fuwa , Yoshiyuki Uchinono
CPC classification number: B29C67/0077 , B22F3/105 , B22F3/1055 , B22F3/16 , B22F5/007 , B22F2003/1056 , B29C35/0805 , B29C64/153 , B29C69/001 , B29C2035/0827 , B29C2035/0833 , B29C2035/0838 , B29K2105/00 , B33Y10/00 , Y02P10/292 , Y02P10/295
Abstract: There is provided a manufacturing method of the three-dimensional shaped object, the method being capable of suitably reducing the local raised portion which can occur during the light beam irradiation under the condition of the divided sub-irradiation paths. The manufacturing method of the present invention is performed by repetition of a powder-layer forming and a solidified-layer forming, wherein an irradiation path of the light beam is divided into a plurality of sub-irradiation paths including a short sub-irradiation path with its length being shorter than a predetermined length and a long sub-irradiation path with its length being the predetermined length or longer, and wherein an irradiation mode of the light beam is changed depending on the lengths of the sub-irradiation paths.
Abstract translation: 提供了三维成形物体的制造方法，该方法能够适当地减少在分割的子照射路径的条件下在光束照射期间可能发生的局部隆起部分。 本发明的制造方法是通过重复粉末层形成和固化层形成而进行的，其中，将光束的照射路径分割为多条子照射路径，其包括短子照射路径， 其长度比预定长度短，长度为预定长度的长子辐射路径长，并且其中根据子辐射路径的长度改变光束的照射模式。
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