- Patent Title: Resin composition, dry-etching resist mask, and patterning method
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Application No.: US15035897Application Date: 2014-12-17
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Publication No.: US09777079B2Publication Date: 2017-10-03
- Inventor: Takeshi Ibe , Makoto Yada
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2013-267015 20131225
- International Application: PCT/JP2014/083447 WO 20141217
- International Announcement: WO2015/098662 WO 20150702
- Main IPC: B29C59/02
- IPC: B29C59/02 ; C08F12/36 ; H01L21/311 ; C08F12/34 ; C08F257/00 ; C08K5/00 ; C08L101/02 ; C08F12/32 ; C09D125/16 ; G03F7/00
Abstract:
Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.
Public/Granted literature
- US20160272737A1 RESIN COMPOSITION, DRY-ETCHING RESIST MASK, AND PATTERNING METHOD Public/Granted day:2016-09-22
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