Invention Grant
- Patent Title: Three-surface wide field-of-view lens system
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Application No.: US14875012Application Date: 2015-10-05
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Publication No.: US09778443B2Publication Date: 2017-10-03
- Inventor: Tingyu Cheng , Jau-Jan Deng
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop Gage LLP
- Main IPC: G02B9/00
- IPC: G02B9/00 ; G02B13/00 ; G02B1/04 ; G02B9/04

Abstract:
A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a first lens surface facing the image plane, and (b) a second wafer-level lens with (i) a second substrate having a second planar surface facing away from the image plane, (ii) a third substrate bonded to the second substrate and having a third planar surface facing the image plane, (iii) a second lens element bonded to the second planar surface and having a second lens surface facing away from the image plane, and (iv) a third lens element bonded to the third planar surface and having a third lens surface facing the image plane.
Public/Granted literature
- US20170097497A1 Three-Surface Wide Field-Of-View Lens System Public/Granted day:2017-04-06
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