- 专利标题： Collars for under-bump metal structures and associated systems and methods
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申请号： US14853807申请日： 2015-09-14
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公开(公告)号： US09780052B2公开(公告)日： 2017-10-03
- 发明人: Giorgio Mariottini , Sameer Vadhavkar , Wayne Huang , Anilkumar Chandolu , Mark Bossler
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Perkins Coie LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L21/00 ; H01L23/00
摘要：
The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
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