Invention Grant
- Patent Title: Molded chip package and method of manufacturing the same
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Application No.: US14287080Application Date: 2014-05-26
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Publication No.: US09780061B2Publication Date: 2017-10-03
- Inventor: Franz Gabler , Horst Theuss
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L21/78 ; H01L23/29 ; H01L21/56
Abstract:
A method of manufacturing a molded chip package is provided which comprises arranging an electronic chip on a supporting structure; forming an isolation layer at least on portions of the electronic chip; and molding an encapsulation which covers the electronic chip and the supporting structure at least partially by using a molding material comprising a matrix material and a conductive filler material.
Public/Granted literature
- US20150340307A1 Molded chip package and method of manufacturing the same Public/Granted day:2015-11-26
Information query
IPC分类:
