Invention Grant
- Patent Title: Method for producing optoelectronic semiconductor components, arrangement and optoelectronic semiconductor component
-
Application No.: US14346673Application Date: 2012-12-11
-
Publication No.: US09780271B2Publication Date: 2017-10-03
- Inventor: Tobias Gebuhr , Michael Zitzlsperger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102011056706 20111220
- International Application: PCT/EP2012/075100 WO 20121211
- International Announcement: WO2013/092308 WO 20130627
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L27/15 ; H01L33/62 ; H01L23/00 ; H01L33/00 ; H01L21/66 ; H01L33/48
Abstract:
In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.
Public/Granted literature
Information query
IPC分类:
