Invention Grant
- Patent Title: Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
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Application No.: US15288228Application Date: 2016-10-07
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Publication No.: US09786672B2Publication Date: 2017-10-10
- Inventor: Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2014-0109042 20140821
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L27/108 ; H01L21/768
Abstract:
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
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