Invention Grant
- Patent Title: Printed wiring board
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Application No.: US14741122Application Date: 2015-06-16
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Publication No.: US09793200B2Publication Date: 2017-10-17
- Inventor: Kota Noda , Takeshi Furusawa
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-124045 20140617
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H01L23/498 ; H05K3/46 ; H01L25/10 ; H05K1/02 ; H01L23/00

Abstract:
A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board.
Public/Granted literature
- US20150366062A1 PRINTED WIRING BOARD Public/Granted day:2015-12-17
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