- 专利标题： Processing assembly for semiconductor workpiece and methods of processing same
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申请号： US12960378申请日： 2010-12-03
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公开(公告)号： US09799537B2公开(公告)日： 2017-10-24
- 发明人: Jason Rye , Kyle M. Hanson
- 申请人： Jason Rye , Kyle M. Hanson
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED Materials, Inc.
- 当前专利权人： APPLIED Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Christensen O'Connor Johnson Kindness PLLC
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/67 ; H01L21/687 ; B08B3/04
摘要：
A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.
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