- Patent Title: Wafer-level hybrid compound lens and method for fabricating same
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Application No.: US14932368Application Date: 2015-11-04
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Publication No.: US09804367B2Publication Date: 2017-10-31
- Inventor: Tsung-Wei Wan , Wei-Ping Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop Gage LLP
- Main IPC: G02B9/00
- IPC: G02B9/00 ; G02B27/10 ; G02B13/00 ; B29D11/00 ; G02B1/04

Abstract:
A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.
Public/Granted literature
- US20170123190A1 Wafer-Level Hybrid Compound Lens And Method For Fabricating Same Public/Granted day:2017-05-04
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