Invention Grant
- Patent Title: Method of forming a wiring part of a flexure
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Application No.: US14694371Application Date: 2015-04-23
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Publication No.: US09804496B2Publication Date: 2017-10-31
- Inventor: Naoki Yamaguchi
- Applicant: NHK Spring Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Norris McLaughlin & Marcus, P.A.
- Priority: JP2010-144287 20100624
- Main IPC: G11B5/127
- IPC: G11B5/127 ; H04R31/00 ; G03F7/36 ; G11B5/48 ; G03F7/20 ; H05K1/05

Abstract:
A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part includes a normal wiring part that is on the metal substrate and an aerial wiring part that is on a space separated from the metal substrate. The base insulating layer of the aerial wiring part is formed to be thinner than that of the normal wiring part. This configuration reduces a rigidity contribution ratio of the wiring part.
Public/Granted literature
- US20150241788A1 FLEXURE AND METHOD OF FORMING PART OF FLEXURE Public/Granted day:2015-08-27
Information query
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