公开(公告)号：US09804496B2

公开(公告)日：2017-10-31

申请号：US14694371

申请日：2015-04-23

Applicant: NHK Spring Co., Ltd.

Inventor： Naoki Yamaguchi

IPC: G11B5/127 ,  H04R31/00 ,  G03F7/36 ,  G11B5/48 ,  G03F7/20 ,  H05K1/05

CPC classification number: G03F7/36 ,  G03F7/20 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K2201/0154 ,  Y10T29/49155

Abstract: A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part includes a normal wiring part that is on the metal substrate and an aerial wiring part that is on a space separated from the metal substrate. The base insulating layer of the aerial wiring part is formed to be thinner than that of the normal wiring part. This configuration reduces a rigidity contribution ratio of the wiring part.

公开(公告)号：US20150241788A1

公开(公告)日：2015-08-27

申请号：US14694371

申请日：2015-04-23

Applicant: NHK Spring Co., Ltd.

Inventor： Naoki Yamaguchi

IPC: G03F7/36 ,  G11B5/48 ,  G03F7/20

CPC classification number: G03F7/36 ,  G03F7/20 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K2201/0154 ,  Y10T29/49155

Abstract: A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part includes a normal wiring part that is on the metal substrate and an aerial wiring part that is on a space separated from the metal substrate. The base insulating layer of the aerial wiring part is formed to be thinner than that of the normal wiring part. This configuration reduces a rigidity contribution ratio of the wiring part.

Abstract translation: 弯曲部包括前端支撑滑块的金属基板和具有基底绝缘层和形成在基底绝缘层上的导体层的布线部。 布线部分包括在金属基板上的正常布线部分和与金属基板分离的空间上的空中布线部分。 天线布线部的基底绝缘层形成为比普通布线部的基底绝缘层薄。 该构造降低了配线部的刚性贡献率。