- 专利标题: Multiple MLCC modules
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申请号: US14963766申请日: 2015-12-09
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公开(公告)号: US09805872B2公开(公告)日: 2017-10-31
- 发明人: Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
- 申请人: Kemet Electronics Corporation
- 申请人地址: US SC Simpsonville
- 专利权人: KEMET Electronics Corporation
- 当前专利权人: KEMET Electronics Corporation
- 当前专利权人地址: US SC Simpsonville
- 代理机构: Perkins Law Firm, LLC
- 代理商 Joseph T. Guy
- 主分类号: H01G4/38
- IPC分类号: H01G4/38 ; H01G2/02 ; H01G4/30 ; H01G4/224 ; H01G4/228
摘要:
An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.
公开/授权文献
- US20170169955A1 Multiple MLCC Modules 公开/授权日:2017-06-15
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