Invention Grant
- Patent Title: Semiconductor package interconnect
-
Application No.: US14854039Application Date: 2015-09-15
-
Publication No.: US09806052B2Publication Date: 2017-10-31
- Inventor: Lizabeth Ann Keser , Reynante Tamunan Alvarado
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; H01L23/00 ; H01L21/683 ; H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L25/16
Abstract:
A semiconductor package interconnect system may include a conductive pillar having a core, a first layer surrounding the core, and a second layer surrounding the first layer. The core may be composed of a drawn copper wire, the first layer may be composed of nickel, and the second layer may be composed of a solder. A method for manufacturing a semiconductor package with such a conductive pillar may include placing a plurality of conductive pillars on a substrate using a stencil process.
Public/Granted literature
- US20170077053A1 SEMICONDUCTOR PACKAGE INTERCONNECT Public/Granted day:2017-03-16
Information query
IPC分类:
