- 专利标题: Silicon-containing heat- or photo-curable composition
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申请号: US15031668申请日: 2014-10-14
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公开(公告)号: US09817312B2公开(公告)日: 2017-11-14
- 发明人: Naofumi Yoshida , Yuji Tashiro
- 申请人: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
- 申请人地址: LU Luxembourg
- 专利权人: AZ Electronic Materials (Luxembourg) S.à r.l.
- 当前专利权人: AZ Electronic Materials (Luxembourg) S.à r.l.
- 当前专利权人地址: LU Luxembourg
- 代理商 Mitchell Brustein
- 优先权: JP2013-218485 20131021; JP2014-189852 20140918
- 国际申请: PCT/JP2014/077299 WO 20141014
- 国际公布: WO2015/060155 WO 20150430
- 主分类号: G03F7/075
- IPC分类号: G03F7/075 ; G03F7/40 ; G03F7/38 ; G03F7/30 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; C09D183/14 ; C08L83/14 ; C08G77/52
摘要:
A heat- or photo-curable composition comprising: a polysiloxane which is produced by reacting a silicon compound (i) represented by the formula: R1nSi(X)4-n (wherein R1 represents an alkyl group, an aryl group or the like; X represents a chlorine atom or an alkoxy group; and n represents 0 to 2) with a silicon compound (ii) represented by the formula (b) or (c) (wherein R2 to R7 independently represent an alkyl group or the like; M1 and M2 independently represent an arylene group, an alkylene group or the like; and Y1 to Y6 independently represent a chlorine atom or an alkoxy group) in the presence of an alkali catalyst or an acid catalyst; a polymerization initiator which enables the generation of an acid or a base by the action of heat or light; and a solvent. The composition enables the formation of a thick film. When the composition is coated onto a substrate, is then heated or exposed to light, is then developed if necessary, and is then heated and cured at a low temperature, a cured film can be formed.
公开/授权文献
- US20160266490A1 SILICON-CONTAINING HEAT- OR PHOTO-CURABLE COMPOSITION 公开/授权日:2016-09-15