Various embodiments include methods and integrated circuit structures. In some cases, a method of forming an integrated circuit structure can include: forming a doped silicon layer over a substrate; forming a plurality of fin structures from the doped silicon layer; forming a plurality of gate structures over the plurality of fin structures, each of the plurality of gate structures separated from a neighboring gate structure by a first pitch; forming a mask over the plurality of gate structures, exposing at least one of the plurality of gate structures; removing the at least one of the plurality of gate structures, wherein two of the remaining gate structures after the removing are separated by a second pitch larger than the first pitch; and forming an epitaxial region over the substrate between the two of the remaining gate structures.