A hot stamping wiring includes a hot stamping film that has insulation properties and can be attached to an insulating part by a hot stamping method, an electronic device having a hot stamping and a hot stamping method are provided. The hot stamping wiring includes a plurality of band-shaped conductors that are formed in a band shape of a material having electrical conductivity, attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and are spaced apart at intervals, and a connector wafer, which includes a plurality of connecting pins corresponding to the plurality of band-shaped conductors, is disposed at the hot stamping film, and is attached to the insulating part by ultrasonic welding, wherein the connector wafer comprises a plurality of junction projections for ultrasonic welding.