公开(公告)号：US09819133B2

公开(公告)日：2017-11-14

申请号：US15258240

申请日：2016-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-il Kim ,  Si-ho Jang

IPC: H01R43/02 ,  H05K1/00 ,  H05K5/00 ,  H01R12/70 ,  H01B1/00 ,  H01R12/59

CPC classification number: H01R43/0207 ,  H01B1/00 ,  H01B7/08 ,  H01B7/40 ,  H01R12/592 ,  H01R12/7041 ,  H05K1/00 ,  H05K5/0017 ,  H05K5/0069

Abstract: A hot stamping wiring includes a hot stamping film that has insulation properties and can be attached to an insulating part by a hot stamping method, an electronic device having a hot stamping and a hot stamping method are provided. The hot stamping wiring includes a plurality of band-shaped conductors that are formed in a band shape of a material having electrical conductivity, attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and are spaced apart at intervals, and a connector wafer, which includes a plurality of connecting pins corresponding to the plurality of band-shaped conductors, is disposed at the hot stamping film, and is attached to the insulating part by ultrasonic welding, wherein the connector wafer comprises a plurality of junction projections for ultrasonic welding.