Invention Grant
- Patent Title: Capacitive MEMS microphone with insulating support between diaphragm and back plate
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Application No.: US14584742Application Date: 2014-12-29
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Publication No.: US09820058B2Publication Date: 2017-11-14
- Inventor: Zhengmin Benjamin Pan , Zhenkui Meng
- Applicant: Zhengmin Benjamin Pan , Zhenkui Meng
- Applicant Address: CN Shenzhen
- Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- Current Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: IPro, PLLC
- Agent Na Xu
- Priority: CN201310754169 20131231
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R19/00

Abstract:
Disclosed is MEMS microphone. The MEMS microphone includes a substrate and a capacitor system disposed on the substrate. The capacitor system has a back plate, a diaphragm, an insulating space formed by the back plate and the diaphragm and at least one insulating support disposed in the insulating space and connected with the back plate or the diaphragm. When the MEMS microphone is working, the insulating support engages with the diaphragm or the back plate thereby dividing the diaphragm into at least two vibrating units which improves the sensitivity and SNR of the MEMS microphone. Meanwhile, the MEMS microphone has the advantage of low cost and is easy to be fabricated.
Public/Granted literature
- US20150189444A1 MEMS Microphone Public/Granted day:2015-07-02
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