Invention Grant
- Patent Title: Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion
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Application No.: US15084726Application Date: 2016-03-30
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Publication No.: US09825387B2Publication Date: 2017-11-21
- Inventor: Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Jonathon Robert Carstens
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H01R12/75 ; H01R12/70 ; H01R13/639

Abstract:
Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.
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