Invention Grant
- Patent Title: Metal oxide semiconductor cell device architecture with mixed diffusion break isolation trenches
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Application No.: US15264560Application Date: 2016-09-13
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Publication No.: US09831272B2Publication Date: 2017-11-28
- Inventor: Xiangdong Chen , Venugopal Boynapalli , Satyanarayana Sahu , Hyeokjin Lim , Mukul Gupta
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox, LLP
- Main IPC: H01L27/118
- IPC: H01L27/118 ; H01L29/06

Abstract:
A standard cell IC includes pMOS transistors in a pMOS region of a MOS device. The pMOS region extends between a first cell edge and a second cell edge opposite the first cell edge. The standard cell IC further includes nMOS transistors in an nMOS region of the MOS device. The nMOS region extends between the first cell edge and the second cell edge. The standard cell IC further includes at least one single diffusion break located in an interior region between the first cell edge and the second cell edge that extends across the pMOS region and the nMOS region to separate the pMOS region into pMOS subregions and the nMOS region into nMOS subregions. The standard cell IC includes a first double diffusion break portion at the first cell edge. The standard cell IC further includes a second double diffusion break portion at the second cell edge.
Public/Granted literature
- US20170287933A1 METAL OXIDE SEMICONDUCTOR CELL DEVICE ARCHITECTURE WITH MIXED DIFFUSION BREAK ISOLATION TRENCHES Public/Granted day:2017-10-05
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