Invention Grant
- Patent Title: Semiconductor light emitting device and method of manufacturing the same
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Application No.: US15172976Application Date: 2016-06-03
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Publication No.: US09831378B2Publication Date: 2017-11-28
- Inventor: Jin Sub Lee , Jung Sub Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0109489 20150803
- Main IPC: H01L33/12
- IPC: H01L33/12 ; H01L33/00 ; H01L31/0236 ; H01L21/02 ; H01L33/22 ; H01L33/04

Abstract:
A method of manufacturing a semiconductor light emitting device is provided. The method includes forming a first region of a lower semiconductor layer on a substrate, etching an upper surface of the first region using at least one gas used in forming the first region, in-situ in a chamber in which a process of forming the first region has been performed, forming a second region of the lower semiconductor layer on the first region, forming an active layer on the lower semiconductor layer, and forming an upper semiconductor layer on the active layer.
Public/Granted literature
- US20170040490A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-02-09
Information query
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