Invention Grant
- Patent Title: Bonding strength test device for electronic components and method for bonding strength test
-
Application No.: US15060568Application Date: 2016-03-03
-
Publication No.: US09835544B2Publication Date: 2017-12-05
- Inventor: Hideki Kashima , Yuji Sugita , Takeshi Shimoda , Tsutomu Fukuda
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NHK SPRING CO., LTD.
- Current Assignee: NHK SPRING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2015-063062 20150325
- Main IPC: G01N19/04
- IPC: G01N19/04 ; G11B5/455 ; G11B5/48

Abstract:
According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.
Public/Granted literature
- US20160282257A1 BONDING STRENGTH TEST DEVICE FOR ELECTRONIC COMPONENTS AND METHOD FOR BONDING STRENGTH TEST Public/Granted day:2016-09-29
Information query