Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15363585Application Date: 2016-11-29
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Publication No.: US09837460B2Publication Date: 2017-12-05
- Inventor: Yosuke Takeuchi , Tatsuya Kunikiyo
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Koutou-ku, Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Koutou-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-256599 20151228
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/11

Abstract:
An improvement is achieved in the performance of a semiconductor device. A semiconductor device includes an n−-type semiconductor region formed in a p-type well, an n-type semiconductor region formed closer to a main surface of a semiconductor substrate than the n−-type semiconductor region, and a p−-type semiconductor region formed between the n−-type semiconductor region and the n-type semiconductor region. A net impurity concentration in the n−-type semiconductor region is lower than a net impurity concentration in the n-type semiconductor region. A net impurity concentration in the p−-type semiconductor region is lower than a net impurity concentration in the p-type well.
Public/Granted literature
- US20170186804A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-29
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