Invention Grant
- Patent Title: Ceiling system
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Application No.: US14868485Application Date: 2015-09-29
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Publication No.: US09845596B2Publication Date: 2017-12-19
- Inventor: William H. Frantz , Gourish Sirdeshpande , Peter J. Oleske , Jere W. Myers , Kenneth P. Roy , Anthony L. Wiker , Shannon M. Weir
- Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
- Applicant Address: US DE Wilmington
- Assignee: AWI Licensing LLC
- Current Assignee: AWI Licensing LLC
- Current Assignee Address: US DE Wilmington
- Agent Craig M. Sterner
- Main IPC: E04B2/00
- IPC: E04B2/00 ; E04B5/00 ; E04B9/00 ; E04B1/76 ; B32B3/12 ; B32B7/02 ; E04B1/90 ; B32B3/14 ; B32B3/26 ; B32B7/00 ; E04B1/88 ; E04B1/80 ; B32B7/12 ; E04B9/04 ; B32B3/20

Abstract:
A ceiling system includes a ceiling support structure supporting a plurality of ceiling panels, each ceiling panel including a core layer having a top surface facing a first interior space above the ceiling panels, a bottom surface facing a second interior space below the ceiling panels, and a plurality of peripheral edges extending between the top and bottom surfaces. A top frame layer extends from the top surface and a thermal layer is on the top frame layer opposite the top surface. The thermal layer has a first surface facing away from the top frame layer and a second surface facing toward the top frame layer. The top frame layer supports the second surface in a spaced-apart manner from the top surface to form one or more air gaps between the top surface and the second surface. The first and second surfaces have a thermal emissivity of 0.5 or less.
Public/Granted literature
- US20170089064A1 CEILING SYSTEM Public/Granted day:2017-03-30
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