公开(公告)号：US11293608B2

公开(公告)日：2022-04-05

申请号：US16898644

申请日：2020-06-11

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske ,  Brian L. Springer ,  Anthony J. Jaskierski ,  Todd M. Bergman ,  Keith A. Koger ,  Christopher D. Gaydos ,  Craig W. Desantis ,  Jere W. Myers ,  Jonathan P. Van Dore ,  G. Douglas Vernau ,  Kenneth P. Kehrer ,  Paul A. Hough ,  Ravindra Deshpande

IPC: F21S8/04 ,  E04B9/00 ,  E04B9/04 ,  F21V21/04 ,  E04B9/24 ,  E04B9/28 ,  E04B9/32 ,  E04B9/36 ,  F21V33/00 ,  F21V7/00 ,  F21V23/00 ,  F21S8/02 ,  F21S8/06

Abstract: An integrated ceiling and light system that incorporates a light module into a ceiling tile. The system may include a grid support system suspended from an overhead support structure that includes at least one grid support element and first and second ceiling tiles supported by the grid support element in an adjacent manner. A nesting cavity may be formed into the first and second ceiling tiles such that a light module may be disposed within the nesting cavity and coupled to the first and second ceiling tiles. The ceiling tiles may be of the type that conceals the grid support element on which it is supported. In one alternative embodiment, the light module and a nesting region of the ceiling tile may include corresponding edge profiles to facilitate mating therebetween to enable coupling of the light source to the ceiling tile.

公开(公告)号：US09845596B2

公开(公告)日：2017-12-19

申请号：US14868485

申请日：2015-09-29

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： William H. Frantz ,  Gourish Sirdeshpande ,  Peter J. Oleske ,  Jere W. Myers ,  Kenneth P. Roy ,  Anthony L. Wiker ,  Shannon M. Weir

IPC: E04B2/00 ,  E04B5/00 ,  E04B9/00 ,  E04B1/76 ,  B32B3/12 ,  B32B7/02 ,  E04B1/90 ,  B32B3/14 ,  B32B3/26 ,  B32B7/00 ,  E04B1/88 ,  E04B1/80 ,  B32B7/12 ,  E04B9/04 ,  B32B3/20

CPC classification number: E04B1/76 ,  B32B3/08 ,  B32B3/085 ,  B32B3/12 ,  B32B3/14 ,  B32B3/20 ,  B32B3/26 ,  B32B3/263 ,  B32B3/266 ,  B32B3/30 ,  B32B5/02 ,  B32B5/022 ,  B32B5/024 ,  B32B5/08 ,  B32B7/00 ,  B32B7/02 ,  B32B7/08 ,  B32B7/12 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B21/00 ,  B32B21/08 ,  B32B27/08 ,  B32B27/12 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2262/0207 ,  B32B2262/023 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/08 ,  B32B2262/101 ,  B32B2262/108 ,  B32B2262/14 ,  B32B2307/102 ,  B32B2307/304 ,  B32B2307/3065 ,  B32B2419/00 ,  B32B2607/00 ,  E04B1/7612 ,  E04B1/806 ,  E04B1/88 ,  E04B1/90 ,  E04B9/001 ,  E04B9/0442 ,  E04B9/045 ,  E04B9/0457 ,  E04B2001/7691 ,  Y10T428/24562 ,  Y10T428/2457 ,  Y10T428/24661 ,  Y10T428/24678

Abstract: A ceiling system includes a ceiling support structure supporting a plurality of ceiling panels, each ceiling panel including a core layer having a top surface facing a first interior space above the ceiling panels, a bottom surface facing a second interior space below the ceiling panels, and a plurality of peripheral edges extending between the top and bottom surfaces. A top frame layer extends from the top surface and a thermal layer is on the top frame layer opposite the top surface. The thermal layer has a first surface facing away from the top frame layer and a second surface facing toward the top frame layer. The top frame layer supports the second surface in a spaced-apart manner from the top surface to form one or more air gaps between the top surface and the second surface. The first and second surfaces have a thermal emissivity of 0.5 or less.

公开(公告)号：US10683977B2

公开(公告)日：2020-06-16

申请号：US15960652

申请日：2018-04-24

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske ,  Brian L. Springer ,  Anthony J. Jaskierski ,  Todd M. Bergman ,  Keith A. Koger ,  Christopher D. Gaydos ,  Craig W. Desantis ,  Jere W. Myers ,  Jonathan P. Van Dore ,  G. Douglas Vernau ,  Kenneth P. Kehrer ,  Paul A. Hough ,  Ravindra Deshpande

IPC: F21S8/04 ,  E04B9/00 ,  E04B9/04 ,  F21V21/04 ,  E04B9/24 ,  E04B9/28 ,  E04B9/32 ,  E04B9/36 ,  F21V33/00 ,  F21V7/00 ,  F21V23/00 ,  F21S8/02 ,  F21S8/06

Abstract: An integrated ceiling and light system that incorporates a light module into a ceiling tile. The system may include a grid support system suspended from an overhead support structure that includes at least one grid support element and first and second ceiling tiles supported by the grid support element in an adjacent manner. A nesting cavity may be formed into the first and second ceiling tiles such that a light module may be disposed within the nesting cavity and coupled to the first and second ceiling tiles. The ceiling tiles may be of the type that conceals the grid support element on which it is supported. In one alternative embodiment, the light module and a nesting region of the ceiling tile may include corresponding edge profiles to facilitate mating therebetween to enable coupling of the light source to the ceiling tile.

公开(公告)号：US09777472B2

公开(公告)日：2017-10-03

申请号：US14925552

申请日：2015-10-28

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Anthony L. Wiker ,  Peter J. Oleske ,  Lida Lu

IPC: E04B9/04 ,  E04B1/86 ,  E04B1/84 ,  E04B1/99 ,  E04B9/06 ,  E04B9/00 ,  E04B1/74

CPC classification number: E04B1/8409 ,  E04B1/86 ,  E04B1/99 ,  E04B9/045 ,  E04B9/067 ,  E04B9/241

Abstract: The present invention is directed to ceiling panels formed from a porous scrim that is coupled to an acoustical substrate using a scrim attachment system that includes an adhesive.

公开(公告)号：US10166736B2

公开(公告)日：2019-01-01

申请号：US15324757

申请日：2014-07-09

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske

IPC: C08G63/02 ,  B32B3/12 ,  B32B5/02 ,  B32B7/02 ,  B32B7/12 ,  E04F13/12 ,  E04F13/16 ,  E04F13/18

Abstract: Described herein are substrates comprising: a core comprising a plurality of open cells; a first facing layer attached to a first major side of the core by a first adhesive; and a second facing layer attached to a second major side of the core by a second adhesive; wherein the glass transition temperature of the second adhesive is greater than the glass transition temperature of the first adhesive.

公开(公告)号：US10131110B2

公开(公告)日：2018-11-20

申请号：US14904963

申请日：2013-07-15

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske

IPC: B32B3/12 ,  B32B5/02 ,  B32B13/08 ,  B32B17/02 ,  B32B15/04 ,  B32B17/06 ,  B32B5/00

Abstract: A light-weight acoustical substrate is disclosed. In one embodiment, the substrate includes a substantially open core and outer facing layers. The core is comprised of a plurality of open, cells which extend between the facing layers. The cells may have numerous configurations, including honeycomb. The facing layers may be non-woven or woven glass scrims in some embodiments, A multi-layered acoustical structure is provided which in one non-limiting embodiment is comprised of two cores with outer facing layers and an interlayer between the cores.

公开(公告)号：US20170203535A1

公开(公告)日：2017-07-20

申请号：US15324757

申请日：2014-07-09

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske

IPC: B32B3/12 ,  E04F13/16 ,  B32B7/12 ,  E04F13/12 ,  B32B5/02 ,  B32B7/02

CPC classification number: B32B3/12 ,  B32B5/022 ,  B32B5/024 ,  B32B5/028 ,  B32B7/02 ,  B32B7/12 ,  B32B2262/101 ,  B32B2307/548 ,  B32B2607/00 ,  E04F13/12 ,  E04F13/16 ,  E04F13/18

Abstract: Described herein are substrates comprising: a core comprising a plurality of open cells; a first facing layer attached to a first major side of the core by a first adhesive; and a second facing layer attached to a second major side of the core by a second adhesive; wherein the glass transition temperature of the second adhesive is greater than the glass transition temperature of the first adhesive.

公开(公告)号：US09951916B2

公开(公告)日：2018-04-24

申请号：US14972813

申请日：2015-12-17

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske ,  Brian L. Springer ,  Anthony J. Jaskierski ,  Todd M. Bergman ,  Keith A. Koger ,  Christopher D. Gaydos ,  Craig W. Desantis ,  Jere W. Myers ,  Jonathan P. Van Dore ,  G. Douglas Vernau ,  Kenneth P. Kehrer ,  Paul A Hough ,  Ravindra Deshpande

IPC: F21S8/04 ,  E04B9/04 ,  E04B9/00 ,  F21V21/04 ,  E04B9/24 ,  E04B9/28 ,  F21S8/02 ,  F21S8/06 ,  E04B9/32 ,  E04B9/36 ,  F21V33/00 ,  F21V7/00

CPC classification number: F21S8/04 ,  E04B9/003 ,  E04B9/006 ,  E04B9/04 ,  E04B9/0421 ,  E04B9/045 ,  E04B9/0464 ,  E04B9/0471 ,  E04B9/241 ,  E04B9/28 ,  E04B9/32 ,  E04B9/366 ,  F21S8/026 ,  F21S8/06 ,  F21V7/0008 ,  F21V21/04 ,  F21V33/006

Abstract: An integrated ceiling and light system that incorporates a light module into a ceiling tile. The system may include a grid support system suspended from an overhead support structure that includes at least one grid support element and first and second ceiling tiles supported by the grid support element in an adjacent manner. A nesting cavity may be formed into the first and second ceiling tiles such that a light module may be disposed within the nesting cavity and coupled to the first and second ceiling tiles. The ceiling tiles may be of the type that conceals the grid support element on which it is supported. In one alternative embodiment, the light module and a nesting region of the ceiling tile may include corresponding edge profiles to facilitate mating therebetween to enable coupling of the light source to the ceiling tile.

公开(公告)号：US20180023291A1

公开(公告)日：2018-01-25

申请号：US15720176

申请日：2017-09-29

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Anthony L. Wiker ,  Peter J. Oleske ,  Lida Lu

IPC: E04B1/84 ,  E04B9/04 ,  E04B9/06 ,  E04B1/99 ,  E04B1/86 ,  E04B9/24

CPC classification number: E04B1/8409 ,  E04B1/86 ,  E04B1/99 ,  E04B9/045 ,  E04B9/064 ,  E04B9/067 ,  E04B9/241

Abstract: The present invention is directed to ceiling panels formed from a porous scrim that is coupled to an acoustical substrate using a scrim attachment system that includes an adhesive.

公开(公告)号：US09783984B2

公开(公告)日：2017-10-10

申请号：US14728404

申请日：2015-06-02

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Peter J. Oleske

IPC: E04B9/22 ,  E04B9/04 ,  E04B9/06

CPC classification number: E04B9/225 ,  E04B9/0442 ,  E04B9/0464 ,  E04B9/067

Abstract: A ceiling system comprises a pair of spaced overhead longitudinal grid support members and a light-weight ceiling panel suspended therefrom. The panel may be an acoustical honeycomb panel in one embodiment. Localized elongated reinforced areas or sections are formed on the top facing which support a plurality of hangers mounted on each section. The reinforced sections coincide in arrangement with the layout of the support members and structurally strengthen the top facing in select areas. In one embodiment, each reinforced section may comprise a stiffening spline attached to the top facing. The ceiling panel is hung from the grid support members via the hangers and reinforced sections. Fasteners may be used to attach the hangers to the reinforced sections which resist pullout when the panel is hung. In certain embodiments, the reinforced sections extend longitudinally through a central portion of the panel to prevent sagging between the panel sides.