Invention Grant
- Patent Title: Electrical isolator packaging structure and manufacturing method for electrical isolator
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Application No.: US14973728Application Date: 2015-12-18
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Publication No.: US09847292B2Publication Date: 2017-12-19
- Inventor: Yuan-Tai Chang , Kai-Cheung Juang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW104136245A 20151104
- Main IPC: H01L43/04
- IPC: H01L43/04 ; H01L23/522 ; H01F27/28 ; H01F41/04 ; H01L27/22 ; H01L49/02

Abstract:
An electrical isolator packaging structure and a manufacturing method of an electrical isolator are provided. The electrical isolator packaging structure includes a first substrate, a second substrate, a coil, and a magnetic field (MF) sensor. The coil is disposed on the first substrate. The MF sensor is disposed on the second substrate. The position of the coil is arranged according to the position of the MF sensor such that the coil transmits a signal to the MF sensor. Thus, the electrical isolator can be implemented by magnetic coupling with the coil and the MF sensor.
Public/Granted literature
- US20170125343A1 ELECTRICAL ISOLATOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR ELECTRICAL ISOLATOR Public/Granted day:2017-05-04
Information query
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