Invention Grant
- Patent Title: Structure analyzing device and a structure analyzing method
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Application No.: US14406242Application Date: 2013-01-11
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Publication No.: US09851331B2Publication Date: 2017-12-26
- Inventor: Yasuhiro Sasaki , Masatake Takahashi , Shigeki Shinoda
- Applicant: NEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2012-129199 20120606
- International Application: PCT/JP2013/050415 WO 20130111
- International Announcement: WO2013/183313 WO 20131212
- Main IPC: G01N29/12
- IPC: G01N29/12 ; G01N29/04 ; G01N29/44 ; G01M3/24 ; G01M7/00

Abstract:
Disclosed is a structure analyzing device and a structure analyzing method which can analyze a state change of a structure, which is caused before the structure is destroyed, such as a state change of degradation of the structure or the like. A structure analyzing device (10) includes a vibration detecting unit (11) which detects a vibration of a structure, and an analysis unit (12) which analyzes an output signal of the vibration detecting unit (11). The analysis unit (12) analyzes a state change of the structure by comparing a value of resonant sharpness Q, which is measured by use of the following formula (1) in a state existing when carrying out analysis, with a value of resonant sharpness Q which is measured by use of the following formula (1) in a standard state.
Public/Granted literature
- US20150177195A1 STRUCTURE ANALYZING DEVICE AND A STRUCTURE ANALYZING METHOD Public/Granted day:2015-06-25
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