Invention Grant
- Patent Title: Manufacturing method of chip package and package substrate
-
Application No.: US15455200Application Date: 2017-03-10
-
Publication No.: US09852973B2Publication Date: 2017-12-26
- Inventor: Wen-Sung Hsu , Ta-Jen Yu
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/40 ; H01L23/498 ; H01L21/768 ; H01L23/538
Abstract:
A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.
Public/Granted literature
- US20170186709A1 MANUFACTURING METHOD OF CHIP PACKAGE AND PACKAGE SUBSTRATE Public/Granted day:2017-06-29
Information query
IPC分类:
