Invention Grant
- Patent Title: Antenna integrated in a package substrate
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Application No.: US14038202Application Date: 2013-09-26
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Publication No.: US09853359B2Publication Date: 2017-12-26
- Inventor: Adel A. Elsherbini , Telesphor Kamgaing
- Applicant: Adel A. Elsherbini , Telesphor Kamgaing
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schiff Hardin LLP
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q9/04 ; H01Q21/06
Abstract:
An antenna integrated in a package substrate, the antenna comprising an upper antenna element, a lower antenna element and a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element.
Public/Granted literature
- US20150084830A1 ANTENNA INTEGRATED IN A PACKAGE SUBSTRATE Public/Granted day:2015-03-26
Information query
