Invention Grant
- Patent Title: Temperature compensation technique for envelope tracking system
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Application No.: US15079204Application Date: 2016-03-24
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Publication No.: US09853608B2Publication Date: 2017-12-26
- Inventor: James M. Retz , Jeff Kaminski
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F1/30 ; H03F3/19 ; H03F3/21 ; H03G3/30 ; H03F1/02 ; H03F3/24

Abstract:
Disclosed is an envelope tracking (ET) system having a transmit (TX) section, a power amplifier (PA), a fast switched-mode power supply (Fast SMPS), and control circuitry. The TX section receives an input signal and provides a modulated signal to the PA. The TX section also generates an ET signal based on a modulation envelope of the modulated signal. The TX section provides an envelope control (EC) signal based on the ET signal to modulate a supply signal provided to the PA by the Fast SMPS. The control circuitry provides a transmit TX gain signal and an ET gain signal to the TX section based on a PA temperature signal, a TX temperature signal, a target power signal, a measured power signal. The control circuitry is configured to maintain the efficiency and linearity of the PA over a wide operating temperature range.
Public/Granted literature
- US20160373071A1 TEMPERATURE COMPENSATION TECHNIQUE FOR ENVELOPE TRACKING SYSTEM Public/Granted day:2016-12-22
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