发明授权
- 专利标题： Electronic component module and method for manufacturing electronic component module
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申请号： US15225379申请日： 2016-08-01
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公开(公告)号： US09860989B2公开(公告)日： 2018-01-02
- 发明人: Shinya Kiyono , Toshitaka Hayashi , Sho Fujita
- 申请人： MURATA MANUFACTURING CO., LTD.
- 申请人地址： JP Kyoto-fu
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto-fu
- 代理机构： Studebaker & Brackett PC
- 优先权： JP2014-019212 20140204
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; H05K7/12 ; H05K1/18 ; H01B1/22 ; H01L23/00 ; H05K3/32 ; B22F1/00 ; B22F7/06 ; H05K1/09 ; H01L23/31 ; B23K35/30 ; B23K35/02
摘要：
An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.
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