公开(公告)号：US20200321323A1

公开(公告)日：2020-10-08

申请号：US16907557

申请日：2020-06-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L21/48

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US20210375841A1

公开(公告)日：2021-12-02

申请号：US17398574

申请日：2021-08-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H01L25/16 ,  H01L21/48 ,  H01L23/498

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US11552020B2

公开(公告)日：2023-01-10

申请号：US17398574

申请日：2021-08-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H05K1/02 ,  H01L23/538 ,  H01L21/48 ,  H01L23/498 ,  H01L25/16 ,  H02M3/00

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US09860989B2

公开(公告)日：2018-01-02

申请号：US15225379

申请日：2016-08-01

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Shinya Kiyono ,  Toshitaka Hayashi ,  Sho Fujita

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/18 ,  H01B1/22 ,  H01L23/00 ,  H05K3/32 ,  B22F1/00 ,  B22F7/06 ,  H05K1/09 ,  H01L23/31 ,  B23K35/30 ,  B23K35/02

CPC分类号： H05K1/181 ,  B22F1/0059 ,  B22F7/064 ,  B23K35/025 ,  B23K35/302 ,  H01B1/22 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13194 ,  H01L2224/13347 ,  H01L2224/13487 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/2939 ,  H01L2224/29487 ,  H01L2224/81075 ,  H01L2224/81193 ,  H01L2224/81359 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8184 ,  H01L2224/83075 ,  H01L2224/8384 ,  H01L2924/12044 ,  H05K1/097 ,  H05K3/32 ,  H05K2201/0257 ,  H05K2201/10015 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0541 ,  H01L2924/01029 ,  H01L2924/01046

摘要： An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.

公开(公告)号：US11121123B2

公开(公告)日：2021-09-14

申请号：US16907557

申请日：2020-06-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H05K3/46 ,  H01L25/16 ,  H01L21/48 ,  H01L23/498 ,  H02M3/00

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US10177108B2

公开(公告)日：2019-01-08

申请号：US15353362

申请日：2016-11-16

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Shinya Kiyono ,  Yoshiaki Satake

IPC分类号： H05K3/34 ,  H05K1/18 ,  H05K13/04 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

摘要： A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component.

公开(公告)号：US09532495B2

公开(公告)日：2016-12-27

申请号：US14062767

申请日：2013-10-24

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Shinya Kiyono ,  Yoshiaki Satake

IPC分类号： H05K3/34 ,  H05K13/04 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L24/17 ,  H01L21/4853 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/11312 ,  H01L2224/11318 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/11505 ,  H01L2224/11515 ,  H01L2224/13017 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1411 ,  H01L2224/16052 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17104 ,  H01L2224/17107 ,  H01L2224/73204 ,  H01L2224/8112 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81439 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2924/3841 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3457 ,  H05K13/0465 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2224/13012 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component.

摘要翻译： 制造电子部件模块的方法和通过该制造方法制造的电子部件模块包括凸块，每个凸起包括具有较大厚度的较厚部分和较薄部分，并且形成在基板的一个表面上。 当以俯视图看待安装状态的电子部件时，较厚部分位于靠近电子部件中心的相应外端子的一侧，较薄部分位于相应外部的相对侧 终奌站。 在平面图中，分别将外端子连接到凸块的接合部分形成为使得相对侧上的每个接合部分的高度低于靠近电子部件中心的一侧的接合部分的高度。