Invention Grant
- Patent Title: Electronic component module and method for manufacturing electronic component module
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Application No.: US15225379Application Date: 2016-08-01
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Publication No.: US09860989B2Publication Date: 2018-01-02
- Inventor: Shinya Kiyono , Toshitaka Hayashi , Sho Fujita
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2014-019212 20140204
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K1/18 ; H01B1/22 ; H01L23/00 ; H05K3/32 ; B22F1/00 ; B22F7/06 ; H05K1/09 ; H01L23/31 ; B23K35/30 ; B23K35/02
Abstract:
An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.
Public/Granted literature
- US20160338201A1 ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE Public/Granted day:2016-11-17
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