A cooling system for a hand-held electronic device includes a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment. A wind driving assembly is mounted in the compartment and includes a frame, a package, and a thermally conductive cover. The thermally conductive cover engages with the frame and the package. An impeller is rotatably arranged in the frame having an outlet hole adjacent to the at least one air outlet. The package receives at least one electronic element that generates heat during operation. The thermally conductive cover includes an inlet hole in communication with an interior of the frame. An air channel is formed between the thermally conductive cover and an interior wall face of the casing. The at least one air inlet intercommunicates with the inlet hole via the air channel.