- 专利标题： Reduction of solder interconnect stress
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申请号： US15251325申请日： 2016-08-30
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公开(公告)号： US09865557B1公开(公告)日： 2018-01-09
- 发明人: Anson J. Call , Vijayeshwar D. Khanna , David J. Russell , Krishna R. Tunga
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Matthew C. Zehrer
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/00 ; H01L23/498 ; H01L21/48
摘要：
An electrical contact upon an interposer and/or upon a processing device includes a minor axis and a major axis. The contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring electrical contacts within the electrical contact grid may differ relative thereto.
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