公开(公告)号：US20180318969A1

公开(公告)日：2018-11-08

申请号：US15802963

申请日：2017-11-03

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: B23K35/362 ,  B23K35/30 ,  B23K35/02 ,  H05K3/34 ,  B23K35/36 ,  B23K35/28 ,  B23K35/26 ,  B23K101/42

CPC classification number: B23K35/362 ,  B23K35/0227 ,  B23K35/025 ,  B23K35/262 ,  B23K35/268 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  H05K3/3463 ,  H05K2203/176

Abstract: A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

公开(公告)号：US20180061799A1

公开(公告)日：2018-03-01

申请号：US15671955

申请日：2017-08-08

Applicant: International Business Machines Corporation

Inventor： Anson J. Call ,  Vijayeshwar D. Khanna ,  David J. Russell ,  Krishna R. Tunga

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/17133 ,  H01L2924/3512

Abstract: A first electrical contact and second contact is upon an interposer and/or upon a processing device. The first contact includes a minor axis and a major axis. The second contact includes diameter axes. The first contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The first electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The first electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring first electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring first electrical contacts within the electrical contact grid may differ relative thereto.

公开(公告)号：US20160286660A1

公开(公告)日：2016-09-29

申请号：US14668031

申请日：2015-03-25

Applicant: International Business Machines Corporation

Inventor： Jeffrey P. Gambino ,  Richard S. Graf ,  Sudeep Mandal ,  David J. Russell

IPC: H05K3/00 ,  H01L21/768 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11 ,  H01L21/48 ,  H01L23/373

CPC classification number: H05K3/0094 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3738 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2021/60007 ,  H01L2224/16225 ,  H05K1/0201 ,  H05K1/115 ,  H05K3/4038

Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having thermally conductive vias in addition to electrically conductive vias. The thermally conductive vias help dissipate heat from one or more IC chips, through the glass interposer, into an organic carrying, and then, into an underlying substrate where it can be dissipated.

Abstract translation: 本发明一般涉及集成电路（IC）芯片封装，更具体地，涉及一种形成具有导电通孔的玻璃插入件以及导电通孔的结构和方法。 导热通孔有助于从一个或多个IC芯片（通过玻璃插入件）将热量散发到有机载体中，然后进入可以被耗散的底层基板。

公开(公告)号：US10342122B2

公开(公告)日：2019-07-02

申请号：US16040790

申请日：2018-07-20

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: H05K5/00 ,  H05K7/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16

Abstract: An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.

公开(公告)号：US10276534B2

公开(公告)日：2019-04-30

申请号：US15671955

申请日：2017-08-08

Applicant: International Business Machines Corporation

Inventor： Anson J. Call ,  Vijayeshwar D. Khanna ,  David J. Russell ,  Krishna R. Tunga

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

Abstract: A first electrical contact and second contact is upon an interposer and/or upon a processing device. The first contact includes a minor axis and a major axis. The second contact includes diameter axes. The first contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The first electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The first electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring first electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring first electrical contacts within the electrical contact grid may differ relative thereto.

公开(公告)号：US20180318968A1

公开(公告)日：2018-11-08

申请号：US15589130

申请日：2017-05-08

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: B23K35/362 ,  H05K3/34 ,  B23K35/02 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K35/0227 ,  B23K35/025 ,  B23K35/262 ,  B23K35/268 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  H05K3/3463 ,  H05K2203/176

Abstract: A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

公开(公告)号：US10080283B1

公开(公告)日：2018-09-18

申请号：US15589142

申请日：2017-05-08

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/0293 ,  H05K1/0201 ,  H05K1/0263 ,  H05K1/11 ,  H05K1/111 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K1/183 ,  H05K1/186 ,  H05K3/341 ,  H05K2201/0308 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/105 ,  H05K2201/10568 ,  H05K2203/043 ,  H05K2203/175 ,  H05K2203/176

Abstract: An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.

公开(公告)号：US09865557B1

公开(公告)日：2018-01-09

申请号：US15251325

申请日：2016-08-30

Applicant: International Business Machines Corporation

Inventor： Anson J. Call ,  Vijayeshwar D. Khanna ,  David J. Russell ,  Krishna R. Tunga

IPC: H01L21/44 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/17133 ,  H01L2924/3512

Abstract: An electrical contact upon an interposer and/or upon a processing device includes a minor axis and a major axis. The contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring electrical contacts within the electrical contact grid may differ relative thereto.

公开(公告)号：US20170351783A1

公开(公告)日：2017-12-07

申请号：US15176101

申请日：2016-06-07

Applicant: International Business Machines Corporation

Inventor： Anson J. Call ,  Vijayeshwar D. Khanna ,  David J. Russell ,  Krishna R. Tunga

IPC: G06F17/50 ,  G06F17/13

CPC classification number: G06F17/50 ,  G06F17/5009 ,  G06F2217/44 ,  G06F2217/80

Abstract: Method of designing a laminate substrate having upper laminate layers and an equal plurality of lower laminate layers including: dividing the laminate substrate into regions having corresponding laminate layer pairs consisting of an upper laminate layer and a lower laminate layer; calculating a net stretching value for each corresponding laminate layer pair in each region to result in net stretching values in each region; summing the net stretching values in each region to result in a net stretching value for each region proportional to a curvature of each local region; calculating a relative out-of-plane displacement for the laminate substrate from the curvature of each local region; calculating a predicted thermal warpage for the laminate substrate; and finalizing a design of the laminate substrate when the predicted thermal warpage is within a predetermined acceptable range.

公开(公告)号：US09484239B2

公开(公告)日：2016-11-01

申请号：US14858014

申请日：2015-09-18

Applicant: International Business Machines Corporation

Inventor： Richard S. Graf ,  Douglas O. Powell ,  David J. Russell ,  David J. West

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/268 ,  H01L21/304 ,  H01L21/67 ,  H01L23/544

CPC classification number: H01L21/6835 ,  H01L21/2686 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.