- 专利标题: Electronic component conveyance device and method of manufacturing taping electronic component array
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申请号: US15182075申请日: 2016-06-14
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公开(公告)号: US09873574B2公开(公告)日: 2018-01-23
- 发明人: Masaru Kakuho , Mitsuo Ebata , Naoto Tanaka
- 申请人: MURATA MANUFACTURING CO., LTD.
- 申请人地址: JP Kyoto-fu
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto-fu
- 代理机构: Studebaker & Brackett PC
- 优先权: JP2015-121299 20150616
- 主分类号: B65G47/24
- IPC分类号: B65G47/24 ; B65G54/02 ; H05K13/02 ; B65G51/03
摘要:
As an electronic component conveyance device that aligns a stack direction of internal electrodes in an electronic component in a highly reliable manner. An interval between a first sidewall and a second sidewall in a midstream part is larger than an interval P3 between the first sidewall and the second sidewall in a downstream part. A first magnetic force generation unit is provided lateral to the first sidewall in the midstream part. The height of a center of the first magnetic force generation unit with respect to a bottom surface is larger than P3/2.
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